Fluxes

Flux Products

Flux Pens

Indium Corporation’s flux pens utilize a spring-loaded applicator tip to deliver a controlled amount of flux to the work surface. The user friendly pin-point applicator is ideal for touch-up and light assembly work. To apply, simply depress the tip of the flux pen against the work area to start the flow of the applicator tip.

Indium Corporation flux pens come in Pb-free and SnPb, no-clean and water wash.

Package-on-Package Flux

Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or PoP solder paste, then and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used. PoP flux is typically preferred over PoP solder paste as it is easier to set-up and control the process. PoP solder paste is primarily used when there is component warpage and the solder paste bridges the gap cause by warping boards or substrates. Colored versions of PoP flux are available – upon request – for help with automated inspection of the flux or even visual inspection for process optimization. The colored versions will aid in ensuring there is PoP flux present on the dipped components.

Semiconductor Flux (Ball Attach)

• WS-446HF: is a robust, halogen-free, water-wash flux that was designed to provide one simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. It has a powerful activator system to promote good wetting on even the most demanding substrate metalizations such as Cu OSP, ENEPIG, and ENIG. Its rheology is suitable for dipping flip-chip applications, as well as pin transfer or printing BGA ball-attach applications, for sphere sizes 0.25mm and above. WS-446HF helps to improve production yield by minimizing non-wet-open defects, missing balls, and electrochemical migration (ECM).
• WS-575-C-RT: a halogen-compliant, room temperature stable, one-step flux that eliminates the need for pre-fluxing
• WS-3600: a robust, halogen-containing flux that works well under challenging conditions
• NC-585: designed for PGA applications; eliminates issues caused by cleaning while still ensuring good solderability

Soldering & Industrial Flux

Indium Corporation manufactures a broad range of fluxes for soldering and industrial use. These include:

• Industrial Flux
• Liquid Soldering Fluxes
• Liquid Tabbing Flux
• Package On Package Flux

TACFlux®

Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where a flux is required. Cycle times are not critical as TACFlux® may sit for hours with no reflow degradation.

TACFlux® 020B-RC is the newest addition to our popular TACFlux® product line. TACFlux® 020B-RC is a no-clean flux formulated for both SnPb and Pb-free soldering. It is halogen-free and passes SIR in the unreflowed state, which is ideal for rework applications where the flux may not be heated properly.

Wave Flux (Alcohol based)

The main advantage of alcohol-based fluxes is that they require less preheat to drive off the solvent prior to entering the wave. This allows assemblers to run smaller wave soldering machines at a higher throughput rate. It also reduces the concern about flux that has not been completely heated inadvertently transferring to the top side of the circuit board.

• WF9940
• WF9942
• WF9958

Products:

• FP-500
• NC-771
• TACFlux® 020B-RC
• TACFlux® 089HF
• WF-9945